Using FEA to develop a MIL-HDBK-2 17 SMT model

A MIL-HDBK-217, Military Handbook for Reliability Prediction of Electronic Equipment, reliability prediction model was developed for surface mount technology (SMT) using thermal finite element analysis (FEA) simulations and environmental test data. FEAs for a number of conditions and packages were performed, the resulting strain values were translated to number of cycles to failure, and data regression distribution techniques were used to generate a failure rate model. This methodology, which is based on established analytical techniques and procedures, provides an alternative procedure for developing failure rate models when traditional approaches are not applicable.<>