Title :
Low cost LIGA processes
Author :
Holmes, A.S. ; Saidam, S.M. ; Lawes, R.A.
Author_Institution :
Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci. Technol. & Med., London, UK
Abstract :
In this paper we describe a generic low-cost LIGA process, in which structures are built up by repeated application of a simple process cycle consisting of seed layer deposition, resist deposition, lithography and electroforming. By using this approach, and combining contact lithography with excimer laser machining, we have made multilevel nickel microturbine parts with structural heights in the range 10 to 100 μm per level
Keywords :
electroforming; 10 to 100 micron; LIGA process; Ni; contact lithography; electroforming; excimer laser micromachining; multilevel nickel microturbine; resist deposition; seed layer deposition;
Conference_Titel :
Microengineering Technologies and How to Exploit Them (Digest No: 1997/076), IEE Colloquium on
Conference_Location :
Birmingham
DOI :
10.1049/ic:19970428
