Title :
The impact of delamination on stress-induced and contamination-related failure in surface mount ICs
Author :
Moore, T.M. ; Kelsall, S.J.
Author_Institution :
Texas Instruments- Inc., Dallas, TX, USA
fDate :
March 31 1992-April 2 1992
Abstract :
A temperature-cycle evaluation is reported of a large-die 132-pin plastic quad flat pack process which includes a comparison of the performances of three mold compounds, two lead frame finishes, and two die surface conditions with and without a polyimide die overcoat. The effect of contamination and moisture exposure on bond pad integrity in 68-pin leaded chip carriers damaged during solder reflow was also examined.<>
Keywords :
VLSI; failure analysis; packaging; reliability; soldering; surface mount technology; 132-pin; 68-pin; PQFP; bond pad integrity; contamination; contamination-related failure; delamination; die surface conditions; large-die; lead frame finishes; leaded chip carriers; moisture exposure; mold compounds; plastic quad flat pack process; polyimide die overcoat; solder reflow; stress induced failure; surface mount ICs; temperature-cycle evaluation; Bonding; Delamination; Electronics packaging; Lead compounds; Moisture; Performance evaluation; Plastics; Polyimides; Surface contamination; Surface finishing;
Conference_Titel :
Reliability Physics Symposium 1992. 30th Annual Proceedings., International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-0473-X
DOI :
10.1109/RELPHY.1992.187642
