Title :
X-ray analysis of the package cracking during reflow soldering
Author :
Harada, M. ; Tanigawa, S. ; Ohizumi, S. ; Ikemura, K.
Author_Institution :
Nitto Denko Corp., Osaka, Japan
fDate :
March 31 1992-April 2 1992
Abstract :
A new X-ray system tests cracking in QFP (quad flat pack) and SOJ, (small outline J-leaded pack) packages. It has been found that package cracking starts in two regions of delamination: (1) between the die pad and the chip, in the case of newly developed resins; and (2) between the die pad and the resin, in the case of older forms of resin. During experimentation, it was found that cracking in SOJ related to the newer resin is caused by vaporization of moisture in the materials attached to the die pad. This was verified through simulation.<>
Keywords :
VLSI; failure analysis; moisture; packaging; radiography; reliability; soldering; QFP; SOJ; X-ray analysis; delamination; package cracking; quad flat pack; reflow soldering; small outline J-leaded pack; vaporization of moisture; Delamination; Electronics packaging; Heating; Laboratories; Moisture; Packaging machines; Reflow soldering; Resins; Temperature; Thermal stresses;
Conference_Titel :
Reliability Physics Symposium 1992. 30th Annual Proceedings., International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-0473-X
DOI :
10.1109/RELPHY.1992.187644
