DocumentCode
2922595
Title
X-ray analysis of the package cracking during reflow soldering
Author
Harada, M. ; Tanigawa, S. ; Ohizumi, S. ; Ikemura, K.
Author_Institution
Nitto Denko Corp., Osaka, Japan
fYear
1992
fDate
March 31 1992-April 2 1992
Firstpage
182
Lastpage
189
Abstract
A new X-ray system tests cracking in QFP (quad flat pack) and SOJ, (small outline J-leaded pack) packages. It has been found that package cracking starts in two regions of delamination: (1) between the die pad and the chip, in the case of newly developed resins; and (2) between the die pad and the resin, in the case of older forms of resin. During experimentation, it was found that cracking in SOJ related to the newer resin is caused by vaporization of moisture in the materials attached to the die pad. This was verified through simulation.<>
Keywords
VLSI; failure analysis; moisture; packaging; radiography; reliability; soldering; QFP; SOJ; X-ray analysis; delamination; package cracking; quad flat pack; reflow soldering; small outline J-leaded pack; vaporization of moisture; Delamination; Electronics packaging; Heating; Laboratories; Moisture; Packaging machines; Reflow soldering; Resins; Temperature; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium 1992. 30th Annual Proceedings., International
Conference_Location
San Diego, CA, USA
Print_ISBN
0-7803-0473-X
Type
conf
DOI
10.1109/RELPHY.1992.187644
Filename
187644
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