Title :
Parallel Manufacturing Ramp of an SOI-based Microprocessor Chip
Author :
Liehr, Michael ; Uram, Kevin J. ; Leong, C.K.
Author_Institution :
IBM Syst. & Technol. Group, Hopewell Junction
Abstract :
The challenges of and approaches to a technology transfer of a 90 nm silicon-on-insulator technology in support of a parallel high volume manufacturing ramp are described.
Keywords :
integrated circuit manufacture; microprocessor chips; silicon-on-insulator; technology transfer; SOI-based microprocessor chip; parallel manufacturing ramp; silicon-on-insulator; size 90 nm; technology transfer; Furnaces; Hardware; Inspection; Manufacturing industries; Microprocessor chips; Pulp manufacturing; Semiconductor device manufacture; Silicon on insulator technology; Technology transfer; Virtual manufacturing;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2007. ASMC 2007. IEEE/SEMI
Conference_Location :
Stresa
Print_ISBN :
1-4244-0652-8
Electronic_ISBN :
1-4244-0653-6
DOI :
10.1109/ASMC.2007.375092
