Title :
New thin plastic package crack mechanism, induced by hot IC die
Author :
Marks, Michael Raj
Author_Institution :
Advanced Micro Devices Pte. Ltd., Singapore
fDate :
March 31 1992-April 2 1992
Abstract :
Fine cracks in thin plastic packages have been observed after board tests and reliability tests with static or dynamic biasing. The new package crack mechanism was investigated and a model is proposed. Cracks in thin plastic packages can occur when the die overheats due to the latchup phenomenon in CMOS ICs. This crack mechanism is attributed to high pressure inside the package created by outgassing of plastic encapsulant material surrounding the overheated die and thermomechanical stresses. Hot-die-induced cracks are similar in appearance to moisture-induced popcorn cracks occurring during vapor-phase solder reflow. This may lead to ambiguity as to the actual cause of failure when such cracks are encountered. Non-destructive and destructive techniques are proposed to distinguish hot-die-induced cracks from popcorn cracks.<>
Keywords :
CMOS integrated circuits; VLSI; failure analysis; packaging; reliability; thermal stress cracking; CMOS ICs; PLCC; PQFP; board tests; dynamic biasing; high pressure; hot IC die; hot-die-induced cracks; latchup phenomenon; outgassing of plastic encapsulant; package crack mechanism; popcorn cracks; reliability tests; thermomechanical stresses; thin plastic packages; Delamination; Geometry; Lead; Life testing; Microscopy; Moisture; Plastic integrated circuit packaging; Plastic packaging; Surface cracks; Temperature;
Conference_Titel :
Reliability Physics Symposium 1992. 30th Annual Proceedings., International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-0473-X
DOI :
10.1109/RELPHY.1992.187645
