DocumentCode
2922674
Title
An Electrically-Detected Magnetic Resonance Study of the Atomic-Scale Effects of Fluorine on the Negative Bias Temperature Instability
Author
Ryan, J.T. ; Lenahan, P.M. ; Krishnan, A.T. ; Krishnan, S. ; Campbell, J.P.
Author_Institution
Pennsylvania State Univ., University Park, PA
fYear
2008
fDate
12-16 Oct. 2008
Firstpage
137
Lastpage
140
Abstract
It has been shown that the negative bias temperature instability (NBTI) may be significantly suppressed through the incorporation of fluorine in the gate oxide. In this study, we use the electrically-detected magnetic resonance technique of spin dependent recombination and standard gated diode current measurements to investigate the atomic-scale processes involved in fluorine\´s suppression of NBTI. Our results indicate that fluorine effectively passivates Si/SiO2 Pb0 center defect precursors, but is much less effective at passivating Si/SiO2 Pb1 center defect precursors. Since these two defects have significantly different densities of states, our results maybe useful in modeling NBTI response in fluorinated oxide devices. Our results also help to provide a fundamental explanation for the observation that fluorination has a strong effect on NBTI in "pure" SiO2 MOS devices, but is ineffective at reducing NBTI in nitrided oxide devices.
Keywords
CMOS integrated circuits; electron-hole recombination; electronic density of states; elemental semiconductors; magnetic resonance; silicon; silicon compounds; Si-SiO2; atomic-scale effects; center defect precursor passivation; densities of states; electrically-detected magnetic resonance; fluorinated oxide devices; fluorine; gate oxide; negative bias temperature instability; spin dependent recombination; standard gated diode current measurements; Atomic measurements; CMOS technology; Degradation; Interface states; MOSFETs; Magnetic resonance; Negative bias temperature instability; Niobium compounds; Paramagnetic resonance; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2008. IRW 2008. IEEE International
Conference_Location
S. Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4244-2194-7
Electronic_ISBN
1930-8841
Type
conf
DOI
10.1109/IRWS.2008.4796105
Filename
4796105
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