• DocumentCode
    2922678
  • Title

    A Straightforward Approach to Introduce FDC-Methods for Wet-Process-Equipment

  • Author

    Lindner, Fritz ; Fischer, Petra ; Macalka, Susanne

  • Author_Institution
    Infineon Technol. Austria AG, Villach
  • fYear
    2007
  • fDate
    11-12 June 2007
  • Firstpage
    214
  • Lastpage
    217
  • Abstract
    In this paper the benefits from introducing FDC- methods for the monitoring of wet-chemistry batch- processors will be outlined. As an example, a typical spray-process equipment shall be used to demonstrate the benefits of using fault detection and classification. These include monitoring of process parameters and frequency of equipment alarms and as result indicating the current state of the equipment. Batch processors usually have a high throughput and in the case of wet-chemistry equipment the process result may be monitored only indirectly. This makes the knowledge about the state of the equipment obligatory for minimizing scrap. Aim of FDC-methods is detecting tool degrading through recording and interpreting the process-parameters during every run and, if necessary, triggering preventive maintenance. Process engineers, maintenance engineers and the equipment operator need to have all the information they need for their decisions delivered in a way they can easily access. To achieve this, Infineon Technologies has implemented various software-tools which all share the same date-base.
  • Keywords
    batch processing (industrial); fault diagnosis; preventive maintenance; process monitoring; production equipment; semiconductor device manufacture; spraying; FDC-methods; Infineon Technologies; fault classification; fault detection; preventive maintenance; process monitoring; scrap minimization; semiconductor industry; spray-process equipment; wet-chemistry batch- processors; Condition monitoring; Degradation; Electronics industry; Fault detection; Frequency; Information retrieval; Preventive maintenance; Spraying; Throughput; Wet etching; FDC; preventive maintenance; wet-chemical process;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference, 2007. ASMC 2007. IEEE/SEMI
  • Conference_Location
    Stresa
  • Print_ISBN
    1-4244-0652-8
  • Electronic_ISBN
    1-4244-0653-6
  • Type

    conf

  • DOI
    10.1109/ASMC.2007.375096
  • Filename
    4259262