Finite element analysis of a SWEAT structure with a 3-D, nonlinear, coupled thermal-electric model

Author

Dion, Michael J.

Author_Institution

SEMATECH, Austin, TX, USA

fYear

1992

fDate

March 31 1992-April 2 1992

Firstpage

232

Lastpage

238

Abstract

The complexities of determining thermal characteristics within the standard wafer electromigration accelerated test (SWEAT) structure during accelerated metal integrity or electromigration tests are discussed. A 3-D, nonlinear, coupled thermal-electric finite element model is developed and was solved with the ANSYS program to investigate heat flow in several regions of the structure. The finite element model is presented. Correlation with nonlinear thermal material parameters is demonstrated, and the importance of modeling lateral heat flow in underlying oxides is shown. Extraction of thermal parameters for use in the EXTRA thermal model is discussed.<>

Keywords

electromigration; electronic engineering computing; finite element analysis; heat conduction; life testing; metallisation; ANSYS program; EXTRA thermal model; SWEAT structure; accelerated testing; coupled thermal-electric model; electromigration tests; finite element model; heat flow; metal integrity testing; modeling lateral heat flow; nonlinear thermal material parameters; standard wafer electromigration accelerated test; thermal parameters extraction; underlying oxides; Coupled mode analysis; Couplings; Electromigration; Equations; Finite element methods; Heating; Life estimation; Solid modeling; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium 1992. 30th Annual Proceedings., International

Conference_Location

San Diego, CA, USA

Print_ISBN

0-7803-0473-X

Type

conf

DOI

10.1109/RELPHY.1992.187651

Filename

187651