• DocumentCode
    2922732
  • Title

    Corrosion susceptibility of thin-film metallizations

  • Author

    Griffin, A.J., Jr. ; Brotzen, F.R. ; McPherson, J.W. ; Dunn, C.F.

  • Author_Institution
    Dept. of Mater. Sci., Rice Univ., Houston, TX, USA
  • fYear
    1992
  • fDate
    March 31 1992-April 2 1992
  • Firstpage
    239
  • Lastpage
    246
  • Abstract
    Anodic DC polarization and AC electrochemical impedance-spectroscopy techniques were applied to obtain a better understanding of the corrosion process in Al and Al-Cu thin-film metallizations. The oxide-layer resistance, oxide-layer/double-layer capacitance, and anodic-polarization scans of Al and Al-Co thin-film metallizations which have been sputtered onto partially oxidized silicon substrates are correlated to oxide-layer thickness, Cu distribution, and oxide-layer integrity. Auger electron spectroscopy was employed to quantify oxide-layer thickness and its apparent influence on impedance-spectroscopy response, while scanning electron microscopy was used to observe the type of corrosion attack. The results discussed are compared with results previously obtained on bulk Al-Co alloys.<>
  • Keywords
    aluminium; aluminium alloys; copper alloys; corrosion testing; metallic thin films; metallisation; sputtered coatings; AC electrochemical impedance-spectroscopy; Al metallisation; Al-Co alloys; Al-Cu metallisation; Cu distribution; SiO/sub 2/ substrates; anodic DC polarisation; anodic-polarization scans; corrosion process; corrosion susceptibility; oxide layer capacitance; oxide-layer resistance; oxide-layer thickness; scanning electron microscopy; thin-film metallizations; Capacitance; Corrosion; Electrons; Impedance; Metallization; Polarization; Semiconductor thin films; Silicon; Sputtering; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium 1992. 30th Annual Proceedings., International
  • Conference_Location
    San Diego, CA, USA
  • Print_ISBN
    0-7803-0473-X
  • Type

    conf

  • DOI
    10.1109/RELPHY.1992.187652
  • Filename
    187652