DocumentCode :
2922873
Title :
Discussion Group (DG) summary: Product Reliability
Author :
Turner, Drew
Author_Institution :
IBM. tel: 802-893-1335; e-mail: aaturner@us.ibm.com
fYear :
2008
fDate :
12-16 Oct. 2008
Firstpage :
153
Lastpage :
153
Keywords :
Accelerated aging; Bridge circuits; Circuit simulation; Electronic mail; Life estimation; Niobium compounds; SPICE; Shape; Titanium compounds; Yield estimation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2008. IRW 2008. IEEE International
Conference_Location :
South lake Tahoe, CA, USA
ISSN :
1930-8841
Print_ISBN :
978-1-4244-2194-7
Electronic_ISBN :
1930-8841
Type :
conf
DOI :
10.1109/IRWS.2008.4796117
Filename :
4796117
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2922873
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