DocumentCode
2922883
Title
Challenges in Reusing Lithography Equipment for Multiple Generations
Author
Banisaukas, Heather B.
Author_Institution
Intel Corp., Hillsboro
fYear
2007
fDate
11-12 June 2007
Firstpage
245
Lastpage
248
Abstract
The capital investment for semiconductor fabrication continues to increase as pricing pressure for microprocessors is greater than ever. This profit margin challenge is especially taxing in the area of lithography as the increasing transistor count also drives an increase in the number of mask layers. The cost of lithography equipment for a leading edge factory today is ~$0.5-1 billion. Intel continues to have an aggressive lithography equipment reuse strategy in order to have a tangible impact on the lithography investment required for each new technology. In this paper, we discuss Intel´s most recent focus regarding lithography equipment reuse, better internal business systems and supplier infrastructure to support multi-generational lithography equipment.
Keywords
electronics industry; lithography; semiconductor device manufacture; Intel; internal business systems; multi-generational lithography equipment; supplier infrastructure; Absorption; Costs; Degradation; Investments; Lenses; Lithography; Optical films; Optical refraction; Protection; Solid lasers; asset management; cost of ownership; high-volume manufacturing; lithography; optical degradation; reuse;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2007. ASMC 2007. IEEE/SEMI
Conference_Location
Stresa
Print_ISBN
1-4244-0652-8
Electronic_ISBN
1-4244-0653-6
Type
conf
DOI
10.1109/ASMC.2007.375109
Filename
4259275
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