• DocumentCode
    2922883
  • Title

    Challenges in Reusing Lithography Equipment for Multiple Generations

  • Author

    Banisaukas, Heather B.

  • Author_Institution
    Intel Corp., Hillsboro
  • fYear
    2007
  • fDate
    11-12 June 2007
  • Firstpage
    245
  • Lastpage
    248
  • Abstract
    The capital investment for semiconductor fabrication continues to increase as pricing pressure for microprocessors is greater than ever. This profit margin challenge is especially taxing in the area of lithography as the increasing transistor count also drives an increase in the number of mask layers. The cost of lithography equipment for a leading edge factory today is ~$0.5-1 billion. Intel continues to have an aggressive lithography equipment reuse strategy in order to have a tangible impact on the lithography investment required for each new technology. In this paper, we discuss Intel´s most recent focus regarding lithography equipment reuse, better internal business systems and supplier infrastructure to support multi-generational lithography equipment.
  • Keywords
    electronics industry; lithography; semiconductor device manufacture; Intel; internal business systems; multi-generational lithography equipment; supplier infrastructure; Absorption; Costs; Degradation; Investments; Lenses; Lithography; Optical films; Optical refraction; Protection; Solid lasers; asset management; cost of ownership; high-volume manufacturing; lithography; optical degradation; reuse;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference, 2007. ASMC 2007. IEEE/SEMI
  • Conference_Location
    Stresa
  • Print_ISBN
    1-4244-0652-8
  • Electronic_ISBN
    1-4244-0653-6
  • Type

    conf

  • DOI
    10.1109/ASMC.2007.375109
  • Filename
    4259275