DocumentCode :
2922883
Title :
Challenges in Reusing Lithography Equipment for Multiple Generations
Author :
Banisaukas, Heather B.
Author_Institution :
Intel Corp., Hillsboro
fYear :
2007
fDate :
11-12 June 2007
Firstpage :
245
Lastpage :
248
Abstract :
The capital investment for semiconductor fabrication continues to increase as pricing pressure for microprocessors is greater than ever. This profit margin challenge is especially taxing in the area of lithography as the increasing transistor count also drives an increase in the number of mask layers. The cost of lithography equipment for a leading edge factory today is ~$0.5-1 billion. Intel continues to have an aggressive lithography equipment reuse strategy in order to have a tangible impact on the lithography investment required for each new technology. In this paper, we discuss Intel´s most recent focus regarding lithography equipment reuse, better internal business systems and supplier infrastructure to support multi-generational lithography equipment.
Keywords :
electronics industry; lithography; semiconductor device manufacture; Intel; internal business systems; multi-generational lithography equipment; supplier infrastructure; Absorption; Costs; Degradation; Investments; Lenses; Lithography; Optical films; Optical refraction; Protection; Solid lasers; asset management; cost of ownership; high-volume manufacturing; lithography; optical degradation; reuse;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2007. ASMC 2007. IEEE/SEMI
Conference_Location :
Stresa
Print_ISBN :
1-4244-0652-8
Electronic_ISBN :
1-4244-0653-6
Type :
conf
DOI :
10.1109/ASMC.2007.375109
Filename :
4259275
Link To Document :
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