DocumentCode
2922940
Title
Acoustic evaluation of electronic plastic packages
Author
Siettmann, James ; Dias, Rajen ; Fiebelkorn, Ken
Author_Institution
Intel Corp., Chandler, AZ, USA
fYear
1992
fDate
March 31 1992-April 2 1992
Firstpage
309
Lastpage
314
Abstract
Describe a technique of C-mode scanning acoustic microscope (CSAM) image acquisition. The role acoustic reflected wave analysis plays in the acquisition of CSAM images is considered. The effect that mold compound thickness and transducer choice have on the resolution of leadframe features in plastic packages is illustrated. Potential applications of acoustic reflected wave analysis are presented.<>
Keywords
acoustic microscopy; acoustic transducers; packaging; C-mode scanning acoustic microscope; CSAM images; acoustic reflected wave analysis; electronic plastic packages; image acquisition; leadframe features; mold compound thickness; transducer choice; Acoustic materials; Acoustic pulses; Acoustic reflection; Acoustic transducers; Acoustic waves; Delamination; Electronics packaging; Focusing; Microscopy; Plastic packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium 1992. 30th Annual Proceedings., International
Conference_Location
San Diego, CA, USA
Print_ISBN
0-7803-0473-X
Type
conf
DOI
10.1109/RELPHY.1992.187662
Filename
187662
Link To Document