Title :
Stress Characterization for Stress-Induced Voiding in Cu/Low K Interconnects with Geometry and Upper Cap Layer Dependences
Author :
Lin, Mingte ; Liang, James W. ; Su, K.C.
Author_Institution :
Reliability Technology and Assurance Div., United Microelectronics Corp., No. 3, Li-Hsin Rd. II, Science-Based Industrial Park, Hsin-Chu City, 30077, Taiwan.
Keywords :
Cities and towns; Geometry; Material properties; Microelectronics; Performance evaluation; Physics; Samarium; Testing; Thermal expansion; Thermal stresses;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2008. IRW 2008. IEEE International
Conference_Location :
South lake Tahoe, CA, USA
Print_ISBN :
978-1-4244-2194-7
Electronic_ISBN :
1930-8841
DOI :
10.1109/IRWS.2008.4796126
