DocumentCode :
2923238
Title :
Surface micromachining materials
Author :
Ward, M.C.L. ; Bozeat, R.J. ; Brunson, K.M. ; King, D.O.
Author_Institution :
DERA, Malvern, UK
fYear :
1997
fDate :
35528
Firstpage :
42552
Lastpage :
42554
Abstract :
Surface micromachining is an attractive micro technology since it exploits very closely the materials, process technology and manufacturing methodology developed for the semiconductor industry. Three dimension structures are created through sequential deposition, patterning and selective removal of layers deposited onto the surface of a silicon wafer. A great advantage of surface micromachining is that the wafer may contain active signal processing electronics. In this way integrated electromechanical devices on the scale of 100 μm can be realised
Keywords :
micromachining; 100 micron; Si; active signal processing electronics; electromechanical devices; microtechnology; semiconductor technology; silicon wafer; surface micromachining materials; three dimensional structures;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Microengineering Technologies and How to Exploit Them (Digest No: 1997/076), IEE Colloquium on
Conference_Location :
Birmingham
Type :
conf
DOI :
10.1049/ic:19970433
Filename :
640898
Link To Document :
بازگشت