• DocumentCode
    2923238
  • Title

    Surface micromachining materials

  • Author

    Ward, M.C.L. ; Bozeat, R.J. ; Brunson, K.M. ; King, D.O.

  • Author_Institution
    DERA, Malvern, UK
  • fYear
    1997
  • fDate
    35528
  • Firstpage
    42552
  • Lastpage
    42554
  • Abstract
    Surface micromachining is an attractive micro technology since it exploits very closely the materials, process technology and manufacturing methodology developed for the semiconductor industry. Three dimension structures are created through sequential deposition, patterning and selective removal of layers deposited onto the surface of a silicon wafer. A great advantage of surface micromachining is that the wafer may contain active signal processing electronics. In this way integrated electromechanical devices on the scale of 100 μm can be realised
  • Keywords
    micromachining; 100 micron; Si; active signal processing electronics; electromechanical devices; microtechnology; semiconductor technology; silicon wafer; surface micromachining materials; three dimensional structures;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Microengineering Technologies and How to Exploit Them (Digest No: 1997/076), IEE Colloquium on
  • Conference_Location
    Birmingham
  • Type

    conf

  • DOI
    10.1049/ic:19970433
  • Filename
    640898