DocumentCode
2923238
Title
Surface micromachining materials
Author
Ward, M.C.L. ; Bozeat, R.J. ; Brunson, K.M. ; King, D.O.
Author_Institution
DERA, Malvern, UK
fYear
1997
fDate
35528
Firstpage
42552
Lastpage
42554
Abstract
Surface micromachining is an attractive micro technology since it exploits very closely the materials, process technology and manufacturing methodology developed for the semiconductor industry. Three dimension structures are created through sequential deposition, patterning and selective removal of layers deposited onto the surface of a silicon wafer. A great advantage of surface micromachining is that the wafer may contain active signal processing electronics. In this way integrated electromechanical devices on the scale of 100 μm can be realised
Keywords
micromachining; 100 micron; Si; active signal processing electronics; electromechanical devices; microtechnology; semiconductor technology; silicon wafer; surface micromachining materials; three dimensional structures;
fLanguage
English
Publisher
iet
Conference_Titel
Microengineering Technologies and How to Exploit Them (Digest No: 1997/076), IEE Colloquium on
Conference_Location
Birmingham
Type
conf
DOI
10.1049/ic:19970433
Filename
640898
Link To Document