Anodic bonding for integrated capacitive sensors

Author

Esashi, U. ; Ura, N. ; Matsumoto, Yuki

Author_Institution

Fac. of Eng., Tohoku Univ., Sendai, Japan

fYear

1992

fDate

4-7 Feb 1992

Firstpage

43

Lastpage

48

Abstract

Anodic bonding of silicon to Pyrex glass was studied from the viewpoint of its application to integrated capacitive sensors. Equipment that was developed to allow substrate bonding in atmosphere and in vacuum is described. Vertical and lateral electrical feedthrough structures, which have excellent electrical properties and airtight performance, were developed. The vertical feedthrough structures were applied to capacitive sensors. Other bonding-related problems that were studied, such as wafer distortion, circuit damage, and metallization are noted

Keywords

diaphragms; electric sensing devices; encapsulation; micromechanical devices; silicon; wafer bonding; Pyrex glass; Si diaphragm; airtight performance; anodic bonding; atmosphere; circuit damage; electrical feedthrough structures; encapsulation; integrated capacitive sensors; metallization; micromechanical devices; substrate bonding; vacuum; wafer distortion; Capacitive sensors; Circuits; Electrostatics; Glass; Silicon; Temperature sensors; Thermal sensors; Voltage; Wafer bonding; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1992, MEMS '92, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robot. IEEE

Conference_Location

Travemunde

Print_ISBN

0-7803-0497-7

Type

conf

DOI

10.1109/MEMSYS.1992.187688

Filename

187688