DocumentCode
2923400
Title
"SiP vs SoC for mobile communications applications"
Author
Belot, Didier
Author_Institution
ST Crolles, Crolles
fYear
2007
fDate
9-11 Dec. 2007
Abstract
Summary form only given. Part of the challenge, when issuing transceiver chips for the telecommunication market today, is not only to make a consistent choice between a set standards, but also to choose the adequate technology, and integration flow. Depending on the standards characteristics and the proposed architecture the choice will lead either to system on chip SOC or to System on module solutions mostly called SIP.
Keywords
mobile communication; system-in-package; system-on-chip; transceivers; SiP; SoC; mobile communications; system on module solutions; transceiver chips; Gallium arsenide; MMICs; Microwave devices; Mobile communication; Phase noise; Power amplifiers; Power generation; Radio frequency; Radiofrequency amplifiers; Transceivers;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio-Frequency Integration Technology, 2007. RFIT 007. IEEE International Workshop on
Conference_Location
Rasa Sentosa Resort
Print_ISBN
978-1-4244-1307-2
Electronic_ISBN
978-1-4244-1308-9
Type
conf
DOI
10.1109/RFIT.2007.4444022
Filename
4444022
Link To Document