Molding of three dimensional microstructures by the LIGA process

Author

Harmening, M. ; Bacher, W. ; Bley, P. ; El-Kholi, A. ; Kalb, H. ; Kowanz, B. ; Menz, W. ; Michel, A. ; Mohr, J.

Author_Institution

Kernforschungszentrum Karlsruhe, Inst. fuer Mikrostrukturtech., Germany

fYear

1992

fDate

4-7 Feb 1992

Firstpage

202

Lastpage

207

Abstract

The authors report that the use of a resist layer, which can be structurized either by plastic molding or by deep-etch X-ray lithography, in addition to the LIGA process allows the fabrication of stepped microstructures. This technique is based on the combination of a high-molecular base layer made of polymethyl methacrylate (PMMA) with an internal adhesion promoter and a low-molecular PMMA, which is suitable for the molding of microstructures due to the addition of an internal mold release agent. This resist system is applied to produce stepped microstructures on the basis of which mold inserts are manufactured by means of electroforming. Using these mold inserts, the molding of stepped LIGA structures of PMMA and of LIGA structures of polyvinylidene fluoride (PVDF) was carried out

Keywords

X-ray lithography; mechatronics; micromechanical devices; photoresists; polymers; 3D microstructures molding; LIGA process; PVDF; deep-etch X-ray lithography; electroforming; fabrication of stepped microstructures; high-molecular base layer; internal adhesion promoter; internal mold release agent; mold inserts; plastic molding; polymethyl methacrylate; polymethylmethacrylate; polyvinylidene fluoride; resist layer; Adhesives; Fabrication; Geometry; Manufacturing; Microstructure; Plastics; Resists; Surface cracks; Testing; X-ray lithography;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1992, MEMS '92, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robot. IEEE

Conference_Location

Travemunde

Print_ISBN

0-7803-0497-7

Type

conf

DOI

10.1109/MEMSYS.1992.187718

Filename

187718