Title :
InterSociety Conference on Thermal Phenomena in Electronic Systems. I-THERM III (Cat. No.92CH3096-5)
Abstract :
The following topics are dealt with: thermal modeling of computer systems and peripheral equipment; phase change thermal control; cryogenics and liquid cooling; innovations in advanced cooling technologies; direct air cooling of systems and components; thermal and thermal-mechanical measurements; methodologies and modeling; MCM (multichip module) and single-chip module thermal control; heat transfer in electronic devices and packages; and thermal considerations in manufacturing
Keywords :
cooling; heat transfer; packaging; MCM; air cooling; computer systems; cooling technologies; cryogenics; electronic devices; heat transfer; liquid cooling; manufacturing; packages; peripheral equipment; phase change thermal control; single-chip module thermal control; thermal modeling; thermal-mechanical measurements;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1992. I-THERM III, InterSociety Conference on
Conference_Location :
Austin, TX, USA
Print_ISBN :
0-7803-0503-5
DOI :
10.1109/ITHERM.1992.187732
