Abstract :
The following topics are dealt with: on-chip communication architectures; thermal issues; behavioral synthesis; LSI design; MPSoC design; IP integration; power analysis; logic optimization; arithmetic optimization; EDA acceleration; system-level design; timing analysis; timing modeling; hardware dependent system; system level architecture; floorplanning; power integrity; signal integrity; 3D integrated circuit design; design for manufacturing; design for reliability; mixed-signal CAD; consumer SoC; system level simulation; package routing techniques; chip routing techniques; ESL design methods; embedded systems; sequential design verification; scan test generation; analog circuit designs; RF circuit designs; high-level design; SoC architectures; memory systems simulation; memory systems optimization; VLSI design; and VLSI architecture.
Keywords :
VLSI; circuit CAD; design for manufacture; integrated circuit design; integrated circuit packaging; large scale integration; network routing; radiofrequency integrated circuits; system-on-chip; 3D integrated circuit design; ESL design methods; IP integration; LSI design; MPSoC design; RF circuit designs; SoC architectures; VLSI architecture; analog circuit designs; arithmetic optimization; chip routing techniques; consumer SoC; design for manufacturing; design for reliability; embedded systems; floorplanning; hardware dependent system; high-level design; logic optimization; memory systems optimization; memory systems simulation; mixed-signal CAD; onchip communication architectures; package routing techniques; power analysis; power integrity; scan test generation; sequential design verification; signal integrity; system level architecture; system level simulation; system-level design; timing analysis; timing modeling;
Conference_Titel :
Design Automation Conference, 2009. ASP-DAC 2009. Asia and South Pacific
Conference_Location :
Yokohama
Print_ISBN :
978-1-4244-2748-2
DOI :
10.1109/ASPDAC.2009.4796416
