3-D measurement of thermal deformations on an ultra-high density circuit module with a laser range probe

Author

Gloeckner, P.J. ; Kokini, K. ; Stevenson, W.H.

Author_Institution

Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA

fYear

1992

fDate

5-8 Feb 1992

Firstpage

165

Lastpage

169

Abstract

A laser triangulation range sensor mounted on a coordinate measuring machine was used to measure thermally induced deformations in a circuit module. The module was housed in an environmental test chamber with optical access for the laser probe and measurements were made over a 25-125°C range with an estimated accuracy of ±5 μm. The results show relative 3-D displacements of circuit module components which could cause failure of the module under thermal stress

Keywords

deformation; displacement measurement; measurement by laser beam; printed circuits; thermal stresses; 25 to 125 C; 3-D displacements; 3-D measurement; coordinate measuring machine; environmental test chamber; laser range probe; laser triangulation range sensor; optical access; thermal deformations; thermal stress; thermally induced deformations; ultra-high density circuit module; Ceramics; Circuit testing; Connectors; Coordinate measuring machines; Density measurement; Electronic packaging thermal management; Probes; Temperature; Thermal expansion; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in Electronic Systems, 1992. I-THERM III, InterSociety Conference on

Conference_Location

Austin, TX

Print_ISBN

0-7803-0503-5

Type

conf

DOI

10.1109/ITHERM.1992.187757

Filename

187757