Title :
3-D measurement of thermal deformations on an ultra-high density circuit module with a laser range probe
Author :
Gloeckner, P.J. ; Kokini, K. ; Stevenson, W.H.
Author_Institution :
Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA
Abstract :
A laser triangulation range sensor mounted on a coordinate measuring machine was used to measure thermally induced deformations in a circuit module. The module was housed in an environmental test chamber with optical access for the laser probe and measurements were made over a 25-125°C range with an estimated accuracy of ±5 μm. The results show relative 3-D displacements of circuit module components which could cause failure of the module under thermal stress
Keywords :
deformation; displacement measurement; measurement by laser beam; printed circuits; thermal stresses; 25 to 125 C; 3-D displacements; 3-D measurement; coordinate measuring machine; environmental test chamber; laser range probe; laser triangulation range sensor; optical access; thermal deformations; thermal stress; thermally induced deformations; ultra-high density circuit module; Ceramics; Circuit testing; Connectors; Coordinate measuring machines; Density measurement; Electronic packaging thermal management; Probes; Temperature; Thermal expansion; Thermal stresses;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1992. I-THERM III, InterSociety Conference on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-0503-5
DOI :
10.1109/ITHERM.1992.187757
