Title :
Temperature solution o f five-layer structure with an embedded circular source
Author :
Chien, David H. ; Wang, Chen Y. ; Lee, Chin C.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
Abstract :
The temperature solution of a five-layer structure with an embedded circular source is reported. The solution is in the form of single integration rather than the double integration of solution for a structure with a rectangular source. An algorithm is developed for effective and accurate calculation of the integral solution. Using the circular source solution, the CPU time for temperature calculation is reduced by a factor of 10 as compared to the rectangular source solution. An important application for the solution is the use of a circular source instead of a square source as the unit source to produce the unit thermal profile for real-time thermal design of integrated circuits. The solution is also valuable for the thermal study and analysis of devices having circular sources such as power transistors and light emitting diodes. An application example is presented
Keywords :
electronic engineering computing; integrated circuit technology; integration; packaging; semiconductor devices; temperature distribution; thermal analysis; CPU time; LED; embedded circular source; five-layer structure; integrated circuits; integration; light emitting diodes; power transistors; real-time thermal design; temperature calculation; unit thermal profile; Central Processing Unit; Consumer electronics; Electronic packaging thermal management; Fourier series; Geometrical optics; Integral equations; Integrated circuit packaging; Light emitting diodes; Power transistors; Temperature;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1992. I-THERM III, InterSociety Conference on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-0503-5
DOI :
10.1109/ITHERM.1992.187759