Interconnect technologies and the thermal performance of MCM

The author compares the thermal performance of multi-chip modules (MCMs) based on their interconnection technology. The comparisons were made for hermetic and conduction cooled use environments. The thermal performances of the chip-first high-density interconnect (HDI) technology, the flipped-chip (FC) technology, and flipped-tape automated bonding (FTAB) technologies were analyzed and compared for MCM applications. The results of the study showed the thermal performance of each interconnect technology and presented the most effective ways to improve the performance of MCMs