Title :
Interconnect technologies and the thermal performance of MCM
Author_Institution :
Texas Instrum., Dallas, TX, USA
Abstract :
The author compares the thermal performance of multi-chip modules (MCMs) based on their interconnection technology. The comparisons were made for hermetic and conduction cooled use environments. The thermal performances of the chip-first high-density interconnect (HDI) technology, the flipped-chip (FC) technology, and flipped-tape automated bonding (FTAB) technologies were analyzed and compared for MCM applications. The results of the study showed the thermal performance of each interconnect technology and presented the most effective ways to improve the performance of MCMs
Keywords :
finite element analysis; flip-chip devices; multichip modules; tape automated bonding; FEM; FTAB; HDI; MCM; conduction cooled use; flipped TAB; flipped-chip; flipped-tape automated bonding; hermetic use; high-density interconnect; interconnection technology; multi-chip modules; thermal performance; Artificial intelligence; Conducting materials; Packaging; Performance analysis; Substrates; Temperature; Thermal conductivity; Thermal expansion; Thermal factors; Thermal resistance;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1992. I-THERM III, InterSociety Conference on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-0503-5
DOI :
10.1109/ITHERM.1992.187768
