DocumentCode
2925113
Title
Statistical modeling and analysis of chip-level leakage power by spectral stochastic method
Author
Shen, Ruijing ; Mi, Ning ; Tan, Sheldon X D ; Cai, Yici ; Hong, Xianlong
Author_Institution
Dept. of Electr. Eng., Univ. of California, Riverside, CA
fYear
2009
fDate
19-22 Jan. 2009
Firstpage
161
Lastpage
166
Abstract
In this paper, we present a novel statistical full-chip leakage power analysis method. The new method can provide a general framework to derive the full-chip leakage current or power in a closed form in terms of the variational parameters, such as the channel length, the gate oxide thickness, etc. It can accommodate various spatial correlations. The new method employs the orthogonal polynomials to represent the variational gate leakages in a closed form first, which is generated by a fast multi-dimensional Gaussian quadrature method. The total leakage currents then are computed by simply summing up the resulting orthogonal polynomials (their coefficients). Unlike many existing approaches, no grid-based partitioning and approximation are required. Instead, the spatial correlations are naturally handled by orthogonal decompositions. The proposed method is very efficient and it becomes linear in the presence of strong spatial correlations. Experimental results show that the proposed method is about 10times faster than the recently proposed method with constant better accuracy.
Keywords
Gaussian processes; digital circuits; leakage currents; polynomials; gate oxide thickness; multidimensional Gaussian quadrature method; orthogonal polynomials; spatial correlations; spectral stochastic method; statistical full-chip leakage power analysis method; variational gate leakages; Circuits; Computer science; Gate leakage; Independent component analysis; Leakage current; Polynomials; Principal component analysis; Stochastic processes; Subthreshold current; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2009. ASP-DAC 2009. Asia and South Pacific
Conference_Location
Yokohama
Print_ISBN
978-1-4244-2748-2
Electronic_ISBN
978-1-4244-2749-9
Type
conf
DOI
10.1109/ASPDAC.2009.4796474
Filename
4796474
Link To Document