Title :
Role of failure-mechanism identification in accelerated testing
Author :
Hu, J.M. ; Barker, D. ; Dasgupta, A. ; Arora, A.
Author_Institution :
CALCE Electron. Packaging Res. Center, Maryland Univ., College Park, MD, USA
Abstract :
The authors summarize common failure mechanisms in electronic devices and packages and investigate possible failure mechanism shifting during accelerated testing. It is noted that in accelerated tests the stress applied can produce failure mechanisms that are different from those observed during actual service conditions. Therefore, failure mechanism identification and the setting up of stress limits for all types of accelerated life tests in order to prevent shifting of the original dominant failure mechanism is necessary. Research on failure mechanism detection needs to be conducted to provide better approaches for failure mechanism identification. If failure mechanism shifting occurs in an accelerated life test, the test data will be unrepresentative for the reliability under actual operating conditions
Keywords :
electronic equipment testing; failure analysis; life testing; accelerated testing; electronic devices; failure-mechanism identification; Acceleration; Chemicals; Corrosion; Educational institutions; Electronic equipment testing; Electronics packaging; Failure analysis; Life estimation; Life testing; Thermal stresses;
Conference_Titel :
Reliability and Maintainability Symposium, 1992. Proceedings., Annual
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-0521-3
DOI :
10.1109/ARMS.1992.187820