Maintenance processor/time stress measurement device (MP/TSMD) use for failure trend analysis

Author

Broadwater, Stuart P. ; Oblak, Tod A. ; Popyack, Leonard J.

Author_Institution

Westinghouse, Baltimore, MD, USA

fYear

1992

fDate

21-23 Jan 1992

Firstpage

228

Lastpage

238

Abstract

The authors define the use of advanced built-in-test-equipment technology to reduce or eliminate reliability and maintainability problems associated with on-equipment fault detection and isolation. System supportability requirements for both mature and new systems defined the need for a subsystem level device to perform built-in-test (BIT) functions in addition to capturing environmental stress data. To satisfy these requirements, a microprocessor-based maintenance processor/time stress measurement device (MP/TSMD) system was developed and field-tested. During 1992, the MP/TSMD will be operationally used to identify failure trends in the B-1B offensive radar system and to provide data for environmental stress simulation at the depot. The authors provide a technical description of the MP/TSMD and the fault logging system designed around it

Keywords

failure analysis; fault location; maintenance engineering; microcomputer applications; stress measurement; B-1B offensive radar system; built-in-test-equipment technology; environmental stress simulation; failure trend analysis; fault detection; fault isolation; fault logging system; maintenance processor; time stress measurement device; Automatic testing; Failure analysis; Fault detection; Maintenance; Microprocessors; Radar; Stress measurement; System testing; Vehicle detection; Weapons;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability and Maintainability Symposium, 1992. Proceedings., Annual

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-0521-3

Type

conf

DOI

10.1109/ARMS.1992.187827

Filename

187827