Title :
19.4: Multi-physics simulations with VORPAL
Author :
Smithe, David ; Stoltz, Peter ; Lin, Ming-Chieh ; Karipides, Dan ; Wang, Haipeng ; Tian, Kai ; Cheng, Gary
Author_Institution :
Tech-X Corp., Boulder, CO, USA
Abstract :
The VORPAL finite-difference time-domain particle-in-cell simulation tool has traditionally been used for accelerator, electromagnetic, and plasma simulations. Approximately two years ago, a generalized PDE (partial differential equation) capability was added to the software, and we are now developing this capability to provide multi-physics simulations capability. Our project focus is on integrated thermal & electromagnetic simulations for superconducting RF accelerators. But we are interested in broadening the scope of applications to include vacuum electronics and other physical processes in addition to EM and thermal. We present benchmarking exercises comparing the VORPAL simulations to experimental measurement, and to other multi-physics software.
Keywords :
accelerator RF systems; electronic engineering computing; finite difference time-domain analysis; partial differential equations; thermal analysis; vacuum microelectronics; VORPAL finite-difference time-domain particle-in-cell simulation tool; VORPAL simulation; electromagnetic simulation; generalized PDE; multiphysics simulation; multiphysics software; partial differential equation; physical process; superconducting RF accelerator; thermal simulation; vacuum electronics; Application software; Electromagnetic measurements; Finite difference methods; Partial differential equations; Particle accelerators; Plasma accelerators; Plasma simulation; Radio frequency; Software measurement; Time domain analysis; cut-cell boundaries; electromagnetic analysis; finite-difference; integrated software; multiple effects; thermal analysis; vorpal;
Conference_Titel :
Vacuum Electronics Conference (IVEC), 2010 IEEE International
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4244-7098-3
DOI :
10.1109/IVELEC.2010.5503449
