• DocumentCode
    2925441
  • Title

    19.4: Multi-physics simulations with VORPAL

  • Author

    Smithe, David ; Stoltz, Peter ; Lin, Ming-Chieh ; Karipides, Dan ; Wang, Haipeng ; Tian, Kai ; Cheng, Gary

  • Author_Institution
    Tech-X Corp., Boulder, CO, USA
  • fYear
    2010
  • fDate
    18-20 May 2010
  • Firstpage
    445
  • Lastpage
    446
  • Abstract
    The VORPAL finite-difference time-domain particle-in-cell simulation tool has traditionally been used for accelerator, electromagnetic, and plasma simulations. Approximately two years ago, a generalized PDE (partial differential equation) capability was added to the software, and we are now developing this capability to provide multi-physics simulations capability. Our project focus is on integrated thermal & electromagnetic simulations for superconducting RF accelerators. But we are interested in broadening the scope of applications to include vacuum electronics and other physical processes in addition to EM and thermal. We present benchmarking exercises comparing the VORPAL simulations to experimental measurement, and to other multi-physics software.
  • Keywords
    accelerator RF systems; electronic engineering computing; finite difference time-domain analysis; partial differential equations; thermal analysis; vacuum microelectronics; VORPAL finite-difference time-domain particle-in-cell simulation tool; VORPAL simulation; electromagnetic simulation; generalized PDE; multiphysics simulation; multiphysics software; partial differential equation; physical process; superconducting RF accelerator; thermal simulation; vacuum electronics; Application software; Electromagnetic measurements; Finite difference methods; Partial differential equations; Particle accelerators; Plasma accelerators; Plasma simulation; Radio frequency; Software measurement; Time domain analysis; cut-cell boundaries; electromagnetic analysis; finite-difference; integrated software; multiple effects; thermal analysis; vorpal;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Electronics Conference (IVEC), 2010 IEEE International
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    978-1-4244-7098-3
  • Type

    conf

  • DOI
    10.1109/IVELEC.2010.5503449
  • Filename
    5503449