Title :
Computation electrical variables induced by magnetic stimulation in 3D thigh model
Author :
Moncada, María E. ; Sarmiento, Consuelo ; Martinez, Alfredo
Author_Institution :
Res. Center, Inst. Tecnol. Metropolitano, Medellin, Colombia
fDate :
Aug. 31 2010-Sept. 4 2010
Abstract :
This paper presents the changes in the electrical variables induced in a 3D thigh model with femoral diaphyseal fracture when it is magnetically stimulated. Three cases with particular geometries of the models were considered: skin, muscle, cortical bone (CB), bone marrow, metal pin, and fracture shape. Fracture shape included electric properties for blood, cartilage, trabecular bone (TB), and cortical bone (CB), to represent the consolidation process. A Helmholtz coil was added to the thigh model as stimulation source. The stimulation signal was between 0.5 and 2 mT, and between 5 and 100 Hz. The results shown than induced electric signals were higher for a change in frequency than a change in magnetic field. An important dependence between frequency, magnetic field, fracture shape, and fracture properties was found. The result suggest that the consolidation process could be better if different magnetic stimulation levels were considered.
Keywords :
bioelectric phenomena; biomagnetism; biomechanics; fracture; orthopaedics; physiological models; 3D thigh model; Helmholtz coil; blood; bone marrow; cartilage; cortical bone; electrical variables; femoral diaphyseal fracture; fracture shape; frequency 5 Hz to 100 Hz; magnetic flux density 0.5 mT to 2 mT; magnetic stimulation; metal pin; muscle; skin; trabecular bone; Blood; Bones; Computational modeling; Current density; Magnetic fields; Muscles; Skin; Bone Development; Calcification, Physiologic; Computer Simulation; Electric Stimulation; Electric Stimulation Therapy; Electromagnetic Fields; Femoral Fractures; Femur; Humans; Models, Biological; Radiation Dosage; Therapy, Computer-Assisted; Thigh; Treatment Outcome;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2010 Annual International Conference of the IEEE
Conference_Location :
Buenos Aires
Print_ISBN :
978-1-4244-4123-5
DOI :
10.1109/IEMBS.2010.5626462