DocumentCode :
2925834
Title :
Dynamic open innovation model of Research And Development management for enterprise globalization
Author :
Wu Li-Jen ; Tsai Chien-Tzu ; Chang Pao-Long
Author_Institution :
Feng Chia Univ., Taichung, Taiwan
fYear :
2011
fDate :
27-30 June 2011
Firstpage :
827
Lastpage :
835
Abstract :
Under the globalization trend, the rapidly changing environment and the disintegration of industry structure bring great challenge to Research and Development (R&D) management for enterprises. The way to get customers´ feedback and information in order to integrate the product R&D with innovation design, flexible manufacturing, responsive services, and global logistics are critical for enhancing performance and competitiveness. This paper conducts a case study based on a high-tech company located in Taiwan´s Hsinchu Science Park to dig out a feasible new approach for adapting traditional R&D management to the global market challenge. By integrating the dynamic system thinking and the open innovation model, this paper construct a dynamic open innovation model. This proposed model consists of systematic innovation method, creative product developing process, structural design flow like QFD and manufacturing SOP defining. This model and the experience of the case company provide some new approach for enterprises to tune their R&D management to respond to the dynamic changing global environment.
Keywords :
globalisation; innovation management; product design; product development; quality function deployment; Hsinchu Science Park; QFD; Taiwan; creative product developing process; customers feedback; dynamic open innovation model; enterprise globalization; research and development management; structural design flow; systematic innovation method; Companies; Concurrent engineering; Globalization; Industries; Product development; Technological innovation; Globalization; Open Innovation; Research and Development;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Technology Management Conference (ITMC), 2011 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-61284-951-5
Type :
conf
DOI :
10.1109/ITMC.2011.5996063
Filename :
5996063
Link To Document :
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