• DocumentCode
    2926467
  • Title

    IO connection assignment and RDL routing for flip-chip designs

  • Author

    Yan, Jin-Tai ; Chen, Zhi-Wei

  • Author_Institution
    Dept. of Comput. Sci. & Inf. Eng., Chung-Hua Univ., Hsinchu
  • fYear
    2009
  • fDate
    19-22 Jan. 2009
  • Firstpage
    588
  • Lastpage
    593
  • Abstract
    Given a set of IO buffers and bump balls with the capacity constraints between bump balls, an O(n2) IO assignment and RDL routing algorithm is proposed to assign all the IO connections and minimize the total wirelength with satisfying the capacity constraints and guarantee 100% routability if the capacity constraint is permitted, where n is the number of bump balls in a flip-chip design. Compared with the combination of the greedy IO assignment and our RDL routing, our IO assignment reduces the global wirelength by 7.6% after global routing and improves the routability by 8.8% after detailed routing on the average. Compared with the combination of our IO assignment, the single-layer BGA global router[8] and our detailed routing phase, our RDL routing reduces the global wirelength by 15.9% after global routing and improve the routability by 10.6% after detailed routing on the average for some tested circuits in reasonable CPU time.
  • Keywords
    ball grid arrays; buffer circuits; flip-chip devices; network routing; IO buffers; RDL routing; flip-chip design; global wirelength; single-layer BGA global router; Algorithm design and analysis; Central Processing Unit; Circuit testing; Complexity theory; Computer science; Design engineering; Joining processes; Packaging; Routing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2009. ASP-DAC 2009. Asia and South Pacific
  • Conference_Location
    Yokohama
  • Print_ISBN
    978-1-4244-2748-2
  • Electronic_ISBN
    978-1-4244-2749-9
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2009.4796544
  • Filename
    4796544