DocumentCode
2926467
Title
IO connection assignment and RDL routing for flip-chip designs
Author
Yan, Jin-Tai ; Chen, Zhi-Wei
Author_Institution
Dept. of Comput. Sci. & Inf. Eng., Chung-Hua Univ., Hsinchu
fYear
2009
fDate
19-22 Jan. 2009
Firstpage
588
Lastpage
593
Abstract
Given a set of IO buffers and bump balls with the capacity constraints between bump balls, an O(n2) IO assignment and RDL routing algorithm is proposed to assign all the IO connections and minimize the total wirelength with satisfying the capacity constraints and guarantee 100% routability if the capacity constraint is permitted, where n is the number of bump balls in a flip-chip design. Compared with the combination of the greedy IO assignment and our RDL routing, our IO assignment reduces the global wirelength by 7.6% after global routing and improves the routability by 8.8% after detailed routing on the average. Compared with the combination of our IO assignment, the single-layer BGA global router[8] and our detailed routing phase, our RDL routing reduces the global wirelength by 15.9% after global routing and improve the routability by 10.6% after detailed routing on the average for some tested circuits in reasonable CPU time.
Keywords
ball grid arrays; buffer circuits; flip-chip devices; network routing; IO buffers; RDL routing; flip-chip design; global wirelength; single-layer BGA global router; Algorithm design and analysis; Central Processing Unit; Circuit testing; Complexity theory; Computer science; Design engineering; Joining processes; Packaging; Routing; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2009. ASP-DAC 2009. Asia and South Pacific
Conference_Location
Yokohama
Print_ISBN
978-1-4244-2748-2
Electronic_ISBN
978-1-4244-2749-9
Type
conf
DOI
10.1109/ASPDAC.2009.4796544
Filename
4796544
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