DocumentCode
292661
Title
The influence of metallization thickness on a microstripline-fed patch antenna
Author
Tzyy-Sheng Horng ; Ming-Ju Tsai ; Ching-Lung Chen ; Alexopoulos, N.G.
Author_Institution
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Volume
2
fYear
1994
fDate
20-24 June 1994
Firstpage
940
Abstract
In the past, integral-equation modeling techniques such as the spectral-domain electric-field integral equation (EFIE) and the mixed-potential integral equation (MPIE) have been employed to accurately characterize microstrip patch antennas. However, due to an insufficient segmentation scheme for current densities inside a finitely thick microstrip, these methods are limited to an idealized microstrip patch with infinitesimal thickness. In the present paper, the spectral-domain EFIE formulation in conjunction with a suitable current expansion mechanism (first introduced in Becks and Wolff, 1992) for analysis of a microstrip via-holes and air-bridges, is used to evaluate the finite metallization thickness effects. For the first time, very rigorous theoretical results are demonstrated to illustrate the influence of metallization thickness on resonant frequency, reflection coefficient and current distribution of a microstripline-fed patch antenna.<>
Keywords
antenna feeds; antenna theory; current density; current distribution; electric fields; electromagnetic wave reflection; integral equations; metallisation; microstrip antennas; spectral-domain analysis; 7.0 to 8.5 GHz; SHF; current densities; current expansion mechanism; electric-field integral equation; metallization thickness; microstripline-fed patch antenna; reflection coefficient; resonant frequency; spectral-domain EFIE formulation; Current density; Current distribution; Geometry; Impedance; Integral equations; Metallization; Microstrip antennas; Patch antennas; Reflection; Resonant frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 1994. AP-S. Digest
Conference_Location
Seattle, WA, USA
Print_ISBN
0-7803-2009-3
Type
conf
DOI
10.1109/APS.1994.407923
Filename
407923
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