• DocumentCode
    2927330
  • Title

    Failure modes of porcelain and toughened glass suspension insulators

  • Author

    Gorur, Ravi S.

  • Author_Institution
    Sch. of Electr., Comput. & Energy Eng., Arizona State Univ., Tempe, AZ, USA
  • fYear
    2011
  • fDate
    5-8 June 2011
  • Firstpage
    221
  • Lastpage
    225
  • Abstract
    The paper highlights the differences in failure modes and electrical and mechanical strengths of porcelain and toughened glass insulators that have been in service for many years. The findings are based on a vast body of published literature, as well as a study performed on insulators that were in service for up to 70 years. The insulators were tested for insulation resistance, dielectric strength, porosity and residual mechanical strength. The microstructure of the porcelain was analyzed using a scanning electron microscope. Significant differences in the compositional and microstructure details of porcelain insulators were observed. The electrical and mechanical strengths of porcelain insulators was found to vary significantly from one manufacturer to another, with some aged insulators showing marginal changes and others showing significant reduction in these parameters. Glass insulators evaluated showed small reduction in their residual mechanical strength when compared to new ones. These differences should have significant impact on system reliability and maintenance procedures adopted by utilities.
  • Keywords
    failure analysis; porcelain insulators; scanning electron microscopy; dielectric strength; maintenance procedures; microstructure; porcelain failure modes; porcelain insulators; residual mechanical strength; scanning electron microscope; system reliability; toughened glass suspension insulators; Aging; Glass; Insulators; Porcelain; Stress; Suspensions; aging; mechanical and electrical strength; microstructure; porcelain; suspension insulators; toughened glass;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2011
  • Conference_Location
    Annapolis, MD
  • ISSN
    pending
  • Print_ISBN
    978-1-4577-0278-5
  • Electronic_ISBN
    pending
  • Type

    conf

  • DOI
    10.1109/EIC.2011.5996150
  • Filename
    5996150