• DocumentCode
    2927479
  • Title

    Simulations with the 3D TLM SCN using FD-TD absorbing boundary conditions

  • Author

    Mueller, U. ; Beyer, A. ; Rittweger, M.

  • Author_Institution
    Dept. of Electr. Eng. & Sonderforschungsbereich, Duisburg Univ., Germany
  • fYear
    1992
  • fDate
    1-5 June 1992
  • Firstpage
    377
  • Abstract
    The FD-TD (finite-difference time-domain) absorbing boundary conditions for one-dimensional wave propagation are adapted to the 3-D SCN (symmetrical condensed node) TLM (transmission line matrix) mesh. The properties of these boundary conditions are characterized for a simple TEM (transverse electromagnetic) waveguide structure, and their applicability to complex structures is demonstrated by calculating scattering parameters for a microstrip step.<>
  • Keywords
    finite element analysis; microstrip components; microstrip lines; waveguide theory; 3D TLM SCN; FD-TD absorbing boundary conditions; TEM; TEM waveguides; complex structures; finite-difference time-domain; microstrip step; one-dimensional wave propagation; scattering parameters; symmetrical condensed node; transmission line matrix; waveguide structure; Boundary conditions; Electromagnetic propagation; Electromagnetic propagation in absorbing media; Electromagnetic scattering; Electromagnetic waveguides; Finite difference methods; Scattering parameters; Symmetric matrices; Time domain analysis; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 1992., IEEE MTT-S International
  • Conference_Location
    Albuquerque, NM, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-0611-2
  • Type

    conf

  • DOI
    10.1109/MWSYM.1992.187991
  • Filename
    187991