DocumentCode :
2927594
Title :
An integrated, low noise patch-clamp amplifier for biological nanopore applications
Author :
Wang, Gang ; Dunbar, William B.
Author_Institution :
Comput. Eng., Univ. of California, Santa Cruz, Santa Cruz, CA, USA
fYear :
2010
fDate :
Aug. 31 2010-Sept. 4 2010
Firstpage :
2718
Lastpage :
2721
Abstract :
We present an integrated, low noise patch-clamp amplifier for biological nanopore applications. Our amplifier consists of an integrator-differentiator architecture coupled with a novel opamp design in the CMOS 0.35 μm process. The post-layout full-chip simulation shows the input referred noise of the amplifier is 0.49 pA RMS over a 5 kHz bandwidth using a verified electrical model for the biological nanopore system. In our biological nanopore experiments studying protein-DNA interactions, we encounter capacitive transients with a nominal settling time of 5 ms. Our amplifier design reduces the settling time to 0.2 ms, without requiring any compensation circuitry.
Keywords :
CMOS integrated circuits; DNA; bioelectric phenomena; biological techniques; biomembrane transport; cellular biophysics; differentiating circuits; integrating circuits; molecular biophysics; operational amplifiers; proteins; CMOS process; amplifier input referred noise; biological nanopore applications; biological nanopore system; capacitive transients; current 0.49 pA; integrated patch clamp amplifier; integrator-differentiator architecture; low noise patch clamp amplifier; opamp design; post layout full chip simulation; protein-DNA interactions; time 0.2 ms; Bandwidth; DNA; Nanobioscience; Noise; Resistors; Transient analysis; Algorithms; Amplifiers, Electronic; Biology; Biomedical Engineering; Computer Simulation; DNA; DNA, Single-Stranded; Electrophysiology; Equipment Design; Escherichia coli Proteins; Hemolysin Proteins; Kinetics; Nanopores; Nanotechnology; Patch-Clamp Techniques; Software;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2010 Annual International Conference of the IEEE
Conference_Location :
Buenos Aires
ISSN :
1557-170X
Print_ISBN :
978-1-4244-4123-5
Type :
conf
DOI :
10.1109/IEMBS.2010.5626570
Filename :
5626570
Link To Document :
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