• DocumentCode
    2927958
  • Title

    Bootstrapped ring oscillator with propagation delay time below 1.0 nsec/stage by standard 0.5µm bottom-gate amorphous Ga2O3-In2O3-ZnO TFT technology

  • Author

    Yin, Huaxiang ; Kim, Sunil ; Kim, Chang Jung ; Park, Jae Chul ; Song, Ihun ; Kim, Sang-Wook ; Lee, Sung-Hoon ; Park, Youngsoo

  • Author_Institution
    Semicond. Lab., Samsung Adv. Inst. of Technol., Yongin
  • fYear
    2008
  • fDate
    15-17 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper describes the design and fabrication of the high performance ring oscillator with the standard 0.5 mum bottom-gate amorphous Ga2O3-In2O3-ZnO TFT technology. A series of process and geometry parameters of devices are sophistically optimized to decrease the circuit signal´s propagation delay and, in particular, a novel 3 TFTs bootstrapped inverter structure using the load-transistor´s overlap capacitance as the bootstrapped capacitor is applied. Finally, the propagation delay time of 0.94 ns/stage for a supply voltage of 9 V is achieved in the 5-stage ring oscillator, which is over 75 times faster than previous report.
  • Keywords
    III-V semiconductors; amorphous semiconductors; bootstrap circuits; capacitors; gallium compounds; indium compounds; oscillators; thin film transistors; wide band gap semiconductors; zinc compounds; Ga2O3-In2O3-ZnO; bootstrapped inverter structure; bootstrapped ring oscillator; circuit signal´s; load-transistor´s; overlap capacitance; propagation delay time; size 0.5 mum; standard bottom-gate amorphous TFT technology; voltage 9 V; Amorphous materials; Capacitance; Circuits; Fabrication; Geometry; Inverters; Propagation delay; Ring oscillators; Signal processing; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2008. IEDM 2008. IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    8164-2284
  • Print_ISBN
    978-1-4244-2377-4
  • Electronic_ISBN
    8164-2284
  • Type

    conf

  • DOI
    10.1109/IEDM.2008.4796619
  • Filename
    4796619