Title :
Electro-thermal analysis of IC´s
Author :
Zamlynski, K. ; Ogradzki, J.
Author_Institution :
Warsaw Univ. of Technol.
fDate :
30 May-2 Jun 1994
Abstract :
A method for electro-thermal (ET) analysis of IC´s has been introduced. It consists of a Newton-Raphson (NR) algorithm and a technique for modelling thermal properties of IC´s including their cases. External ET device models for the analyzer OPTIMA-3 have been developed. The flow of heat is modelled by a thermal circuit, separately synthesized and identified for a given layout of heating and temperature sensitive elements
Keywords :
Newton-Raphson method; circuit analysis computing; cooling; integrated circuit design; integrated circuit modelling; integrated circuit packaging; transient analysis; IC modelling; Newton-Raphson algorithm; OPTIMA-3; electro-thermal analysis; external ET device models; heat flow; temperature sensitive elements; thermal circuit; thermal properties; Capacitance; Circuit analysis; Circuit synthesis; Electric resistance; Equations; Heating; Signal synthesis; Temperature; Thermal resistance; Transient analysis;
Conference_Titel :
Circuits and Systems, 1994. ISCAS '94., 1994 IEEE International Symposium on
Conference_Location :
London
Print_ISBN :
0-7803-1915-X
DOI :
10.1109/ISCAS.1994.408744
