Title :
Key challenges in practical realization of Si photonics products
Author :
Asghari, M. ; Luff, B.J. ; Feng, D. ; Fong, J.
Author_Institution :
Kotura Inc., Monterey, CA
Abstract :
In this paper we review the key challenges associated with the successful development of Si photonic products. These will include issues such as device performance, wafer fabrication, on chip assembly and product packaging.
Keywords :
elemental semiconductors; optical materials; optical waveguides; silicon; Si; Si photonics; chip assembly; product packaging; wafer fabrication; Electronics industry; Etching; Fabrication; Manufacturing; Optical losses; Optical refraction; Optical sensors; Optical variables control; Optical waveguides; Photonics;
Conference_Titel :
IEEE/LEOS Winter Topical Meeting Series, 2008
Conference_Location :
Sorrento
Print_ISBN :
978-1-4244-1594-6
Electronic_ISBN :
978-1-4244-1595-3
DOI :
10.1109/LEOSWT.2008.4444380
