DocumentCode
292826
Title
Optimal placement of heat dissipating elements [ hybrid power circuits ]
Author
Ziólko, Mariusz
Author_Institution
Inst. of Electron. AGH, Krakow, Poland
Volume
1
fYear
1994
fDate
30 May-2 Jun 1994
Firstpage
97
Abstract
An effective numerical method makes it possible to find such location of heat dissipating elements that the greatest temperature of elements sensitive to the temperature is as low as possible
Keywords
circuit CAD; cooling; hybrid integrated circuits; integrated circuit design; power integrated circuits; cooling; element location; heat dissipating elements; hybrid power circuits; numerical method; optimal placement; Aluminum oxide; Boundary conditions; Conducting materials; Cooling; Integral equations; Monolithic integrated circuits; Resistors; Temperature distribution; Temperature sensors; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 1994. ISCAS '94., 1994 IEEE International Symposium on
Conference_Location
London
Print_ISBN
0-7803-1915-X
Type
conf
DOI
10.1109/ISCAS.1994.408764
Filename
408764
Link To Document