Title :
New test method to evaluate the thermal aging of aramid materials
Author :
Filliben, Shawn A.
Author_Institution :
E.I. du Pont de Nemours & Co., Richmond, VA, USA
Abstract :
A new test method has been developed to understand the performance of aramid paper in contact with copper. Basic property tests might suggest products in the same chemical family would deliver equivalent performance. This thermal degradation testing method can be used to quantify performance differences between products and allow the designer to select the proper product for the application.
Keywords :
ageing; copper; insulation testing; Cu; aramid materials; chemical family; thermal aging; thermal degradation testing method; Aging; Degradation; Dielectric breakdown; Insulation; Materials; Testing; Thermal degradation; aramid; copper; thermal degradation;
Conference_Titel :
Electrical Insulation Conference (EIC), 2011
Conference_Location :
Annapolis, MD
Print_ISBN :
978-1-4577-0278-5
Electronic_ISBN :
pending
DOI :
10.1109/EIC.2011.5996196
