The thermal and electrical properties of nano-silicon dioxide filled epoxy systems for use in high voltage insulation

Author

Reading, Martin ; Xu, Zhiqiang ; Vaughan, Alun S. ; Lewin, Paul L.

Author_Institution

Electron. & Comput. Sci. Dept., Univ. of Southampton, Southampton, UK

fYear

2011

fDate

5-8 June 2011

Firstpage

493

Lastpage

497

Abstract

Epoxy resins have proven to be an excellent insulation system in many application due to their excellent mechanical, thermal and electrical properties. This paper details an investigation into micro and nano silicon dioxide (SD and NSD respectively) filled epoxy systems and the resulting thermal and electrical properties of the composite. The effect of addition of the fillers relative to their particle size on the overall properties of a DER 332 epoxy was investigated. The composites were characterised using techniques such as differential scanning calorimetry (DSC) and AC breakdown to analyse the effect the filler has on the composite materials glass transition temperature and uniformity through breakdown variation.

Keywords

composite materials; insulators; resins; silicon compounds; AC breakdown; DER 332 epoxy; SiO₂; breakdown variation; composite materials glass transition temperature; differential scanning calorimetry; electrical properties; epoxy resins; epoxy systems; high voltage insulation; mechanical properties; thermal properties; transition uniformity; Dispersion; Electric breakdown; Loading; Permittivity; Polymers; Silicon compounds; AC breakdown; DSC; dielectric; epoxy; insulation; microcomposite; nanocomposite; silica;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation Conference (EIC), 2011

Conference_Location

Annapolis, MD

ISSN

pending

Print_ISBN

978-1-4577-0278-5

Electronic_ISBN

pending

Type

conf

DOI

10.1109/EIC.2011.5996206

Filename

5996206