DocumentCode :
2928456
Title :
The thermal and electrical properties of nano-silicon dioxide filled epoxy systems for use in high voltage insulation
Author :
Reading, Martin ; Xu, Zhiqiang ; Vaughan, Alun S. ; Lewin, Paul L.
Author_Institution :
Electron. & Comput. Sci. Dept., Univ. of Southampton, Southampton, UK
fYear :
2011
fDate :
5-8 June 2011
Firstpage :
493
Lastpage :
497
Abstract :
Epoxy resins have proven to be an excellent insulation system in many application due to their excellent mechanical, thermal and electrical properties. This paper details an investigation into micro and nano silicon dioxide (SD and NSD respectively) filled epoxy systems and the resulting thermal and electrical properties of the composite. The effect of addition of the fillers relative to their particle size on the overall properties of a DER 332 epoxy was investigated. The composites were characterised using techniques such as differential scanning calorimetry (DSC) and AC breakdown to analyse the effect the filler has on the composite materials glass transition temperature and uniformity through breakdown variation.
Keywords :
composite materials; insulators; resins; silicon compounds; AC breakdown; DER 332 epoxy; SiO2; breakdown variation; composite materials glass transition temperature; differential scanning calorimetry; electrical properties; epoxy resins; epoxy systems; high voltage insulation; mechanical properties; thermal properties; transition uniformity; Dispersion; Electric breakdown; Loading; Permittivity; Polymers; Silicon compounds; AC breakdown; DSC; dielectric; epoxy; insulation; microcomposite; nanocomposite; silica;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference (EIC), 2011
Conference_Location :
Annapolis, MD
ISSN :
pending
Print_ISBN :
978-1-4577-0278-5
Electronic_ISBN :
pending
Type :
conf
DOI :
10.1109/EIC.2011.5996206
Filename :
5996206
Link To Document :
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