DocumentCode :
2928462
Title :
Evaluation of the influence of nano fillers on the electrical and dielectric properties of epoxy resin
Author :
Shirazi, M. M Saei ; Borsi, H. ; Gockenbach, E.
Author_Institution :
Schering Inst., Leibniz Univ. Hannover, Hannover, Germany
fYear :
2011
fDate :
5-8 June 2011
Firstpage :
498
Lastpage :
501
Abstract :
Nano fillers have been found in recent years in several areas of technology and can cause electrical, mechanical and chemical improvements. In this study, host material, namely bisphenol-A epoxy resin as indoor application, and related micro filler are the same for all produced samples. Al2O3 has been considered as nano fillers. Nano fillers were mixed with the host material using ultrasound device and high speed mixer simultaneously. An even distribution of the nano fillers was validated by means of transmission electron microcopy. The investigations were carried out under homogeneous (plane-plane) and inhomogeneous (rod-plane) electric field configuration. The influences of the amount of the nano fillers up to 10% part by weight (pbw) and the temperature from 23°C to 180°C on the partial discharge (PD) inception voltage and breakdown voltage of the specimens are investigated.
Keywords :
aluminium compounds; dielectric properties; epoxy insulation; nanocomposites; partial discharges; Al2O3; bisphenol-A epoxy resin; breakdown voltage; dielectric properties; electrical properties; high speed mixer; inhomogeneous electric field; micro filler; nano fillers; partial discharge inception voltage; plane-plane electric field; rod-plane electric field; temperature 23 C to 180 C; transmission electron microcopy; ultrasound device; Aluminum oxide; Electrodes; Epoxy resins; Insulation; Nonuniform electric fields; Partial discharges; high voltage insulation system; nano filler; nanocomposite;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference (EIC), 2011
Conference_Location :
Annapolis, MD
ISSN :
pending
Print_ISBN :
978-1-4577-0278-5
Electronic_ISBN :
pending
Type :
conf
DOI :
10.1109/EIC.2011.5996207
Filename :
5996207
Link To Document :
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