• DocumentCode
    2928462
  • Title

    Evaluation of the influence of nano fillers on the electrical and dielectric properties of epoxy resin

  • Author

    Shirazi, M. M Saei ; Borsi, H. ; Gockenbach, E.

  • Author_Institution
    Schering Inst., Leibniz Univ. Hannover, Hannover, Germany
  • fYear
    2011
  • fDate
    5-8 June 2011
  • Firstpage
    498
  • Lastpage
    501
  • Abstract
    Nano fillers have been found in recent years in several areas of technology and can cause electrical, mechanical and chemical improvements. In this study, host material, namely bisphenol-A epoxy resin as indoor application, and related micro filler are the same for all produced samples. Al2O3 has been considered as nano fillers. Nano fillers were mixed with the host material using ultrasound device and high speed mixer simultaneously. An even distribution of the nano fillers was validated by means of transmission electron microcopy. The investigations were carried out under homogeneous (plane-plane) and inhomogeneous (rod-plane) electric field configuration. The influences of the amount of the nano fillers up to 10% part by weight (pbw) and the temperature from 23°C to 180°C on the partial discharge (PD) inception voltage and breakdown voltage of the specimens are investigated.
  • Keywords
    aluminium compounds; dielectric properties; epoxy insulation; nanocomposites; partial discharges; Al2O3; bisphenol-A epoxy resin; breakdown voltage; dielectric properties; electrical properties; high speed mixer; inhomogeneous electric field; micro filler; nano fillers; partial discharge inception voltage; plane-plane electric field; rod-plane electric field; temperature 23 C to 180 C; transmission electron microcopy; ultrasound device; Aluminum oxide; Electrodes; Epoxy resins; Insulation; Nonuniform electric fields; Partial discharges; high voltage insulation system; nano filler; nanocomposite;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2011
  • Conference_Location
    Annapolis, MD
  • ISSN
    pending
  • Print_ISBN
    978-1-4577-0278-5
  • Electronic_ISBN
    pending
  • Type

    conf

  • DOI
    10.1109/EIC.2011.5996207
  • Filename
    5996207