DocumentCode
2928759
Title
3.5: Sheet beam EIK sensitivity to multimoding and circuit imperfections
Author
Pasour, John ; Nguyen, Khanh ; Wright, Edward ; Levush, Baruch
Author_Institution
Vacuum Electron. Branch, US Naval Res. Lab., Washington, DC, USA
fYear
2010
fDate
18-20 May 2010
Firstpage
45
Lastpage
46
Abstract
A sheet-beam Extended Interaction Klystron (EIK) is an attractive MMW amplifier because of its enhanced power capability, compactness, and relatively high gain per unit length. However, an intrinsic problem with a sheet beam amplifier is its susceptibility to multimoding, which results because the width of the device is typically larger than a wavelength. Even in its ideal configuration, a sheet beam slow wave structure can support a number of closely spaced modes. Furthermore, small imperfections or asymmetries can excite a fundamental TE10 mode in the rectangular beam tunnel, which can cause oscillation or otherwise degrade performance. We have performed 3D PIC simulations (using MAGIC and ICEPIC) to study these effects in several different EIK structures. We will describe methods for minimizing the deleterious effects of multimoding and imperfections, present results of the simulations, and compare the two PIC codes.
Keywords
klystrons; millimetre wave amplifiers; slow wave structures; 3D PIC simulations; MMW amplifier; PIC codes; circuit imperfections; extended interaction klystron; multimoding; sheet beam EIK sensitivity; sheet beam slow wave structure; Circuits; Frequency; High power amplifiers; Klystrons; Laboratories; Low voltage; Millimeter wave technology; Optical coupling; Power generation; Topology; EIK; ICEPIC; MAGIC; Sheet beam; amplifier; millimeter wave; vacuum electronic;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electronics Conference (IVEC), 2010 IEEE International
Conference_Location
Monterey, CA
Print_ISBN
978-1-4244-7098-3
Type
conf
DOI
10.1109/IVELEC.2010.5503612
Filename
5503612
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