• DocumentCode
    2929056
  • Title

    Improved effective switching current (IEFF+) and capacitance methodology for CMOS circuit performance prediction and model-to-hardware correlation

  • Author

    Yu, Xiaojun ; Han, Shu-Jen ; Zamdmer, Noah ; Deng, Jie ; Nowak, Edward J. ; Rim, Ken

  • Author_Institution
    Semicond. Res. & Dev. Center, IBM, Hopewell Junction, NY
  • fYear
    2008
  • fDate
    15-17 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    New effective drive current IEFF + methodologies are demonstrated in this paper to address predictability of circuit performance across wide Vt range and accuracy of effective resistance REFF prediction-to-hardware correlation. Two separate IEFF definitions are adopted for delay performance prediction (IEFF = [IH + IL]/2), and ring AC/DC prediction-tohardware correlation analysis (IEFF + = [1.15IH + IL + GDS,LIN* VDD/80]/2). IEFF + results in perfect matching in ring AC and DC effective resistance across SOI and bulk technologies. IEFF combined with Vt-dependent effective switching capacitance (CEFF_Delay) also leads to good match between predicted performance and spice simulation across wide Vt range using simple CMOS device parameters.
  • Keywords
    CMOS integrated circuits; SPICE; integrated circuit modelling; integrated circuit reliability; silicon-on-insulator; switching; CMOS circuit performance prediction; SOI technology; SPICE simulation; bulk technology; capacitance methodology; delay performance prediction; effective switching current; model-to-hardware correlation; ring AC/DC prediction-to-hardware correlation; Analytical models; Capacitance; Circuit optimization; Circuit simulation; Delay effects; Inverters; Performance analysis; Predictive models; Semiconductor device modeling; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2008. IEDM 2008. IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    8164-2284
  • Print_ISBN
    978-1-4244-2377-4
  • Electronic_ISBN
    8164-2284
  • Type

    conf

  • DOI
    10.1109/IEDM.2008.4796666
  • Filename
    4796666