DocumentCode :
2929193
Title :
Background-free THz imaging using interferometric tomography
Author :
Johnson, J.L. ; Dorney, T. ; Mittleman, D.
Author_Institution :
Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
fYear :
2000
fDate :
7-12 May 2000
Firstpage :
526
Lastpage :
527
Abstract :
Summary form only given. THz imaging is an emerging technology that permits three-dimensional tomographic imaging of nonmetallic objects. Numerous applications have been demonstrated where THz imaging could be a valuable complement to existing technologies for noninvasive testing, including the detection of faults or delaminations in packaged integrated circuits and the location of air bubbles or cracks within polymer or ceramic parts. In many of these applications, the feature one wishes to detect is subtle, in the sense that its interaction with the single-cycle THz pulse imposes only a small additional distortion on the waveform. A good example is the detection of a delamination or disbonding between two surfaces. In many practical cases, the gap which opens up between the two surfaces is narrower than the coherence length of the THz pulse, and the waveform is little changed as a result. We report on the use of interferometry in combination with THz tomography, for improving the detectability of such subtle features. This idea has analogies to optical coherence tomography, in which the signal pulse, reflected off of the sample, is interfered with a reference wave to provide enhanced sensitivity.
Keywords :
infrared imaging; light interferometry; nondestructive testing; optical images; optical tomography; sensitivity; THz imaging; THz pulse; THz tomography; additional distortion; air bubbles; background-free THz imaging; ceramic parts; coherence length; cracks; delamination; detectability; disbonding; enhanced sensitivity; fault; interferometric tomography; interferometry; noninvasive testing; nonmetallic objects; optical coherence tomography; packaged integrated circuits; polymer parts; reference wave; signal pulse; single-cycle THz pulse; three-dimensional tomographic imaging; waveform; Circuit testing; Coherence; Delamination; Integrated circuit technology; Integrated circuit testing; Optical imaging; Optical interferometry; Optical pulses; Optical surface waves; Tomography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics, 2000. (CLEO 2000). Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
1-55752-634-6
Type :
conf
DOI :
10.1109/CLEO.2000.907344
Filename :
907344
Link To Document :
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