Design and Integration Technology for Miniature Medical Microsystems

Author

Van Hoof, C. ; Neves, H. ; Aarts, A.A.A. ; Iker, F. ; Soussan, P. ; Gonzalez, M. ; Beyne, E. ; Vanfleteren, J. ; Puers, R.P. ; De Moor, P.

Author_Institution

IMEC, Leuven

fYear

2008

fDate

15-17 Dec. 2008

Firstpage

1

Lastpage

4

Abstract

The electronic subsystem of wearable and implantable devices is constructed using board-level and package-level integration technology and this limits the achievable miniaturization. We will show that this limitation can be overcome by emerging wafer-level integration methods such as chip-in-wire technology. These technologies can even achieve mechanically bendable and stretchable subsystems.

Keywords

bioMEMS; biomedical electronics; prosthetics; wafer-scale integration; chip-in-wire technology; implantable devices; mechanically bendable subsystems; mechanically stretchable subsystems; miniature medical microsystem design; wafer-level integration method; wearable devices; Biomedical monitoring; Capacitive sensors; Cochlear implants; Dielectric materials; Electrodes; Electronics packaging; Integrated circuit interconnections; Integrated circuit technology; Space technology; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting, 2008. IEDM 2008. IEEE International

Conference_Location

San Francisco, CA

ISSN

8164-2284

Print_ISBN

978-1-4244-2377-4

Electronic_ISBN

8164-2284

Type

conf

DOI

10.1109/IEDM.2008.4796683

Filename

4796683