• DocumentCode
    2929738
  • Title

    Simulation of a conductive shield plate for the focalization of transcranial magnetic stimulation in the rat

  • Author

    Gasca, Fernando ; Richter, Lars ; Schweikard, Achim

  • Author_Institution
    Grad. Sch. for Comput. in Med. & Life Sci., Univ. of Lubeck, Lübeck, Germany
  • fYear
    2010
  • fDate
    Aug. 31 2010-Sept. 4 2010
  • Firstpage
    1593
  • Lastpage
    1596
  • Abstract
    Transcranial Magnetic Stimulation (TMS) in the rat is a powerful tool for investigating brain function. However, the state-of-the-art experiments are considerably limited because the stimulation usually affects undesired anatomical structures. A simulation of a conductive shield plate placed between the coil stimulator and the rat brain during TMS is presented. The Finite Element (FE) method is used to obtain the 3D electric field distribution on a four-layer rat head model. The simulations show that the shield plate with a circular window can improve the focalization of stimulation, as quantitatively seen by computing the three-dimensional half power region (HPR). Focalization with the shield plate showed a clear compromise with the attenuation of the induced field. The results suggest that the shield plate can work as a helpful tool for conducting TMS rat experiments on specific targets.
  • Keywords
    brain; finite element analysis; transcranial magnetic stimulation; 3D electric field distribution; brain function; conductive shield plate; finite element method; four-layer rat head model; three-dimensional half power region; transcranial magnetic stimulation; Attenuation; Brain models; Coils; Geometry; Magnetic stimulation; Three dimensional displays; Animals; Brain; Computer Simulation; Computer-Aided Design; Equipment Design; Equipment Failure Analysis; Magnetics; Models, Neurological; Rats; Transcranial Magnetic Stimulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2010 Annual International Conference of the IEEE
  • Conference_Location
    Buenos Aires
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-4123-5
  • Type

    conf

  • DOI
    10.1109/IEMBS.2010.5626674
  • Filename
    5626674