Title :
Fabrication and test of a hermetic miniature implant package with 360 electrical feedthroughs
Author :
Schuettler, Martin ; Ordonez, Juan S. ; Santisteban, Tomas Silva ; Schatz, Andreas ; Wilde, Juergen ; Stieglitz, Thomas
Author_Institution :
Dept. of Microsyst. Eng. - IMTEK, Univ. of Freiburg, Freiburg, Germany
fDate :
Aug. 31 2010-Sept. 4 2010
Abstract :
A fabrication technology for small hermetic implant packages with large numbers of electrical feedthroughs is presented. First prototypes were fabricated on a ceramic substrate of 25·25 mm area, having a metal cup of 5 mm height soldered to it. These prototypes provide 360 feedthroughs. The electrical properties of the feedthroughs are characterized and the leakage rate of the packages is determined using helium fine leak tests. The amount of water sealed inside the packages is investigated. Based on maximum allowable water vapour concentrations inside hermetic packages reported in literature and applying a commonly accepted mathematical model, we predicted a minimum lifetime to water-induced failure of a few hundred years.
Keywords :
bioceramics; biomedical electrodes; biomedical electronics; electronics packaging; microfabrication; microfluidics; prosthetics; ceramic substrate; electrical feedthroughs; fabrication technology; helium fine leak tests; hermetic miniature implant package; hermetic packages; maximum allowable water vapour concentrations; water seal; Dielectrics; Helium; Humidity; Implants; Metals; Moisture; Substrates; Electric Wiring; Electronics, Medical; Equipment Design; Equipment Failure Analysis; Humidity; Miniaturization; Product Packaging; Prostheses and Implants;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2010 Annual International Conference of the IEEE
Conference_Location :
Buenos Aires
Print_ISBN :
978-1-4244-4123-5
DOI :
10.1109/IEMBS.2010.5626677
