A device for vacuum drying, inert gas backfilling and solder sealing of hermetic implant packages

Author

Schuettler, Martin ; Huegle, Matthias ; Ordonez, Juan S. ; Wilde, Juergen ; Stieglitz, Thomas

Author_Institution

Dept. of Microsyst. Eng., Univ. of Freiburg, Freiburg, Germany

fYear

2010

fDate

Aug. 31 2010-Sept. 4 2010

Firstpage

1577

Lastpage

1580

Abstract

Modern implanted devices utilize microelectronics that have to be protected from the body fluids in order to maintain their functionality over decades. Moisture protection of implants is addressed by enclosing the electronic circuits into gas-tight packages. In this paper we describe a device that allows custom-built hermetic implant packages to be vacuum-dried (removing residual moisture from inside the package), backfilled with an inert gas at adjustable pressure and hermetically sealed employing a solder seal. A typical operation procedure of the device is presented.

Keywords

drying; electronics packaging; hermetic seals; prosthetics; body fluids; gas-tight packages; hermetic implant packages; inert gas backfilling; microelectronics; modern implanted devices; moisture protection; solder sealing; vacuum drying; Atmosphere; Helium; Humidity; Implants; Iron; Temperature sensors; Desiccation; Equipment Design; Equipment Failure Analysis; Helium; Product Packaging; Prostheses and Implants; Vacuum; Water; Welding;

fLanguage

English

Publisher

ieee

Conference_Titel

Engineering in Medicine and Biology Society (EMBC), 2010 Annual International Conference of the IEEE

Conference_Location

Buenos Aires

ISSN

1557-170X

Print_ISBN

978-1-4244-4123-5

Type

conf

DOI

10.1109/IEMBS.2010.5626688

Filename

5626688