• DocumentCode
    2930534
  • Title

    High-frequency effects in carbon nanotube interconnects and implications for on-chip inductor design

  • Author

    Li, Hong ; Banerjee, Kaustav

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, CA
  • fYear
    2008
  • fDate
    15-17 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents a rigorous investigation of high-frequency effects in carbon nanotube interconnects and their implications for the design and performance analysis of high-quality on-chip inductors. An accurate method is developed to calculate the frequency-dependent resistance and inductance of both single-walled (SWCNT) and multi-walled carbon nanotube (MWCNT) bundle interconnects. Our analysis reveals for the first time that skin effect (current redistribution) in CNT bundles is negligible compared to that in conventional metal conductors, which make them a very attractive and promising material for high-frequency applications, including on-chip inductor design in high-performance RF/mixed-signal circuits. It is subsequently shown that CNT based inductors can achieve nearly 4times higher Q factor than Cu based inductors.
  • Keywords
    Q-factor; VLSI; carbon nanotubes; inductors; integrated circuit design; integrated circuit interconnections; nanotube devices; skin effect; Q factor; VLSI design; carbon nanotube interconnects; frequency-dependent resistance; high-frequency effects; high-performance RF circuits; mixed-signal circuits; multiwalled CNT; on-chip inductor design; single-walled CNT; skin effect; Carbon nanotubes; Conducting materials; Inductance; Inductors; Inorganic materials; Integrated circuit interconnections; Performance analysis; Q factor; Radio frequency; Skin effect;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2008. IEDM 2008. IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    8164-2284
  • Print_ISBN
    978-1-4244-2377-4
  • Electronic_ISBN
    8164-2284
  • Type

    conf

  • DOI
    10.1109/IEDM.2008.4796741
  • Filename
    4796741