• DocumentCode
    2930660
  • Title

    Atomistic modeling of fluorine implantation and diffusion in III-nitride semiconductors

  • Author

    Yuan, Li ; Wang, Maojun ; Chen, Kevin J.

  • Author_Institution
    Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong
  • fYear
    2008
  • fDate
    15-17 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A hybrid molecular dynamics (MD)/kinetic Monte Carlo (KMC) model is developed for atomistic modeling of fluorine ion implantation and diffusion in AlGaN/GaN heterostructures. The MD simulation reveals the F distribution profiles and the corresponding defect profiles, and most importantly, the potential energies of fluorine ions in the III-nitride material system. Using the results from the MD simulation, the diffusion process is simulated with KMC method, and the modeling results are validated by the secondary-ion-mass-spectrum (SIMS) measurement. The surface effect on the fluorine´s stability and its improvement by passivation are also successfully modeled.
  • Keywords
    III-V semiconductors; Monte Carlo methods; aluminium compounds; diffusion; fluorine; gallium compounds; ion implantation; molecular dynamics method; potential energy surfaces; secondary ion mass spectra; semiconductor doping; wide band gap semiconductors; AlGaN-GaN:F; AlGaN/GaN heterostructures; F distribution profiles; III-nitride semiconductors; atomistic modeling; diffusion; fluorine ion implantation; kinetic Monte Carlo model; molecular dynamics model; potential energies; secondary-ion-mass-spectrum; Aluminum gallium nitride; Diffusion processes; Gallium nitride; HEMTs; Ion implantation; MODFETs; Plasma immersion ion implantation; Plasma simulation; Potential energy; Stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2008. IEDM 2008. IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    8164-2284
  • Print_ISBN
    978-1-4244-2377-4
  • Electronic_ISBN
    8164-2284
  • Type

    conf

  • DOI
    10.1109/IEDM.2008.4796746
  • Filename
    4796746